Future Direction of Solid State Micro-Joining Applied to Environmentally Friendly Electronic Packaging
نویسنده
چکیده
近年,低炭素社会を目指すことが叫ばれている.地 球温暖化阻止のためである.二酸化炭素等の温暖化ガ ス排出を抑制するための政策が実施され,2008 年に は,新たに省エネ法も改正された.各事業者の社会的 責任(CSR)はますます大きくなっている.その結果, 製造業での無駄は非常に少なくなり,まさに,乾いた 雑巾になりつつある.一方,民生・運輸事業,個人レベ ルでは,まだまだ「しぼり」が足りない感がある.こ の「しぼり」を増すために,我々の技術イノベーショ ンが必要となろう.商品(製品)の総合エネルギー効 率はかなり良くなってきた.エネルギー効率アップは エレクトロニクス実装技術革新によって支えられてい ると言って過言でない.有害物質フリーで環境負荷低 減の要求は当然のこととして,1990年代後半以降,微 細高密度/三次元化への技術革新が加速している [1]~ [4],当初は,ユビキタス高度情報化社会を目指した微 細化,微少化の達成であった.しかし,地球温暖化問 題が浮上し,温暖化問題が全世界喫緊の課題となった. 高度情報化社会形成は,エネルギー資源節約の観点か
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